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Our roadmap is to deliver off the shelf; |
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- Soft IPs and IPCores
- Hard IP Cores
- Reference Designs
- Product Prototypes
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We focus on Physical layer, MAC layer, RLC and Stacks as individual components as well as complete integrated solutions in C/C++, DSP, RTL and GDS-II solutions for the wireless markets in the following domains: |
- 3GP LTE
- Femtocells
- WLAN MIMO: IEEE 802.11n
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| All our present development efforts will dovetail in to future & evolving standards. |
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Customer Segments |
We are committed to build strong relationships with customers in the segments of OEMs & ODMs, ASIP, SOC, Foundries, Fabless Semiconductors, Tools, Test and Measuring Instruments, Research and Development Organizations. |
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Partners & Collaborative Approaches: |
| We seek Regional Business Partners. The criterion for accepting partners to our ecosystem would be; |
- Existing businesses in similar technology domain (example Test & Measurement, System Integration Companies, Design Consultancies etc).
- Must have a large customer base.
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Collaborative approach: |
- We are open to discussions on assignments that include our IP Cores licensing with customization to meet special features with proprietary needs.
- We are open to collaborate with organizations that already have Wireless IP Core products and would like to use our expertise for ‘performance tuning’ and ‘go to market strategies’.
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